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6. April 2018
Participation at the Thin Wall Packaging Conference. Marbach in Chicago.
Marbach Werkzeugbau was represented at the 7th Thin Wall Packaging Conference in Chicago in 2018. This event took place on March 20 and 21.
The Thin Wall Packaging Conference is characterized by an exciting congress program as well as intensive exchange of experiences among participants. Since the founding of this conference, Marbach has been a major sponsor. In particular, Marbach seeks to demonstrate its competence there in the area of food packaging. Marbach General Sales Manager Hubert Kittelmann: "Here the close cooperation between Marbach and other technologies that compete with thermoforming, such as injection molding and the often combined in-mould labelling, are of benefit to us. We can best advise our customers for a secure future."
At this year's event, on the topic "Thermoforming 4.0" Marbach was able to convince visitors with a presentation on the current state of digital technology in thermoforming tools.
